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EE 402A: Topics in International Technology Management

Theme for Autumn 2014 is ¿New Trends in Start-Up Company Acceleration: Toward the Rise of the Global Start-Up.¿ The series features new incubator and accelerator programs in Silicon Valley and select Asia economies that promote early development of international business operations by start-up companies. How can start-up companies cope with the challenges of business globalization? What are the implications of these new models of incubation for the future of Asia economies and for Silicon Valley? Distinguished speakers from industry and government. May be repeated for credit. Please see syllabus for specific requirements, which may differ from those of other seminars at Stanford.
Terms: Aut | Units: 1 | Repeatable for credit
Instructors: Dasher, R. (PI)

EE 402T: Entrepreneurship in Asian High-Tech Industries

Distinctive patterns and challenges of entrepreneurship in Asia; update of business and technology issues in the creation and growth of start-up companies in major Asian economies. Distinguished speakers from industry, government, and academia. Course may be repeated for credit.
Terms: Spr | Units: 1 | Repeatable for credit
Instructors: Dasher, R. (PI)

EE 410: Integrated Circuit Fabrication Laboratory

Fabrication, simulation, and testing of a submicron CMOS process. Practical aspects of IC fabrication including silicon wafer cleaning, photolithography, etching, oxidation, diffusion, ion implantation, chemical vapor deposition, physical sputtering, and electrical testing. Students also simulate the CMOS process using process simulator TSUPREM4 of the structures and electrical parameters that should result from the process flow. Taught in the Stanford Nanofabrication Facility (SNF). Preference to students pursuing doctoral research program requiring SNF facilities. Enrollment limited to 20. Prerequisites: EE 212, EE 216, consent of instructor.
Terms: Win | Units: 3-4
Instructors: Saraswat, K. (PI)

EE 412: Advanced Nanofabrication Laboratory

Experimental projects and seminars on integrated circuit fabrication using epitaxial, oxidation, diffusion, evaporation, sputtering, and photolithographic processes with emphasis on techniques for achieving advanced device performance. May be repeated for additional credit. Prerequisites: ENGR341 or EE410 or consent of instructor.
Terms: Aut, Spr | Units: 3 | Repeatable for credit
Instructors: Howe, R. (PI)

EE 414: RF Transceiver Design Laboratory

Students design, build, and test GHz transceivers using microstrip construction techniques and discrete components. The design, construction, and experimental characterization of representative transceiver building blocks: low noise amplifiers (LNAs), diode ring mixers, PLL-based frequency synthesizers, voltage-controlled oscillators (VCOs), power amplifiers (PAs), and microstrip filters and patch antennas. The characteristics of passive microstrip components (including interconnect). Emphasis is on a quantitative reconciliation of theoretical predictions and extensive experimental measurements performed with spectrum and network analyzers, time-domain reflectometers (TDRs), noise figure meter and phase noise analyzers. Prerequisites: EE 314, EE 251.
Terms: Win | Units: 3
Instructors: Lee, T. (PI)

EE 469B: RF Pulse Design for Magnetic Resonance Imaging

Magnetic resonance imaging (MRI) and spectroscopy (MRS) based on the use of radio frequency pulses to manipulate magnetization. Analysis and design of major types of RF pulses in one and multiple dimensions, analysis and design of sequences of RF pulses for fast imaging, and use of RF pulses for the creation of image contrast in MRI. Prerequisite: 369B.
Terms: Spr | Units: 3
Instructors: Pauly, J. (PI)

EE 801: TGR Project

Terms: Aut, Win, Spr, Sum | Units: 0 | Repeatable for credit
Instructors: Aghajan, H. (PI) ; Allison, D. (PI) ; Arbabian, A. (PI) ; Bahai, A. (PI) ; Bambos, N. (PI) ; Boneh, D. (PI) ; Bosi, M. (PI) ; Boyd, S. (PI) ; Bravman, J. (PI) ; Bube, R. (PI) ; Byer, R. (PI) ; Cheriton, D. (PI) ; Cioffi, J. (PI) ; Cover, T. (PI) ; Cox, D. (PI) ; Cui, Y. (PI) ; DaRosa, A. (PI) ; Dally, B. (PI) ; Dasher, R. (PI) ; Dill, D. (PI) ; Duchi, J. (PI) ; Dutton, R. (PI) ; El Gamal, A. (PI) ; Emami-Naeini, A. (PI) ; Engler, D. (PI) ; Fan, S. (PI) ; Franklin, G. (PI) ; Fraser-Smith, A. (PI) ; Garcia-Molina, H. (PI) ; Gibbons, J. (PI) ; Gill, J. (PI) ; Girod, B. (PI) ; Goldsmith, A. (PI) ; Goodman, J. (PI) ; Gray, R. (PI) ; Hanrahan, P. (PI) ; Harris, J. (PI) ; Harris, S. (PI) ; Hennessy, J. (PI) ; Hesselink, L. (PI) ; Horowitz, M. (PI) ; Howe, R. (PI) ; Inan, U. (PI) ; Kahn, J. (PI) ; Katti, S. (PI) ; Kazovsky, L. (PI) ; Khuri-Yakub, B. (PI) ; Kino, G. (PI) ; Kovacs, G. (PI) ; Kozyrakis, C. (PI) ; Lall, S. (PI) ; Lee, T. (PI) ; Levis, P. (PI) ; Levoy, M. (PI) ; Linscott, I. (PI) ; McCluskey, E. (PI) ; McKeown, N. (PI) ; Meng, T. (PI) ; Miller, D. (PI) ; Mitra, S. (PI) ; Montanari, A. (PI) ; Murmann, B. (PI) ; Nishi, Y. (PI) ; Nishimura, D. (PI) ; Olukotun, O. (PI) ; Osgood, B. (PI) ; Palanker, D. (PI) ; Paulraj, A. (PI) ; Pauly, J. (PI) ; Pease, R. (PI) ; Pelc, N. (PI) ; Pianetta, P. (PI) ; Plummer, J. (PI) ; Poon, A. (PI) ; Pop, E. (PI) ; Popelka, G. (PI) ; Prabhakar, B. (PI) ; Pratt, V. (PI) ; Rivas-Davila, J. (PI) ; Rosenblum, M. (PI) ; Saraswat, K. (PI) ; Shahidi, R. (PI) ; Shen, Z. (PI) ; Shenoy, K. (PI) ; Siegel, M. (PI) ; Solgaard, O. (PI) ; Thrun, S. (PI) ; Tobagi, F. (PI) ; Tyler, G. (PI) ; Van Roy, B. (PI) ; Vuckovic, J. (PI) ; Wang, S. (PI) ; Weissman, T. (PI) ; Widom, J. (PI) ; Widrow, B. (PI) ; Wong, H. (PI) ; Wong, S. (PI) ; Wooley, B. (PI) ; Yamamoto, Y. (PI) ; Zebker, H. (PI)

EE 802: TGR Dissertation

May be repeated for credit.
Terms: Aut, Win, Spr, Sum | Units: 0 | Repeatable for credit
Instructors: Allison, D. (PI) ; Arbabian, A. (PI) ; Bahai, A. (PI) ; Bambos, N. (PI) ; Bent, S. (PI) ; Boahen, K. (PI) ; Boneh, D. (PI) ; Bosi, M. (PI) ; Bowden, A. (PI) ; Boyd, S. (PI) ; Bravman, J. (PI) ; Bube, R. (PI) ; Byer, R. (PI) ; Cheriton, D. (PI) ; Cioffi, J. (PI) ; Cover, T. (PI) ; Cox, D. (PI) ; DaRosa, A. (PI) ; Dally, B. (PI) ; Dasher, R. (PI) ; Dill, D. (PI) ; Duchi, J. (PI) ; Dutton, R. (PI) ; El Gamal, A. (PI) ; Emami-Naeini, A. (PI) ; Enge, P. (PI) ; Engler, D. (PI) ; Eshleman, V. (PI) ; Fan, S. (PI) ; Flynn, M. (PI) ; Franklin, G. (PI) ; Fraser-Smith, A. (PI) ; Garcia-Molina, H. (PI) ; Gibbons, F. (PI) ; Gibbons, J. (PI) ; Gill, J. (PI) ; Girod, B. (PI) ; Glover, G. (PI) ; Goldsmith, A. (PI) ; Goodman, J. (PI) ; Gorinevsky, D. (PI) ; Gray, R. (PI) ; Guibas, L. (PI) ; Hanrahan, P. (PI) ; Harris, J. (PI) ; Harris, S. (PI) ; Helms, C. (PI) ; Hennessy, J. (PI) ; Hesselink, L. (PI) ; Horowitz, M. (PI) ; Howe, R. (PI) ; Inan, U. (PI) ; Kahn, J. (PI) ; Kailath, T. (PI) ; Katti, S. (PI) ; Kazovsky, L. (PI) ; Khuri-Yakub, B. (PI) ; Kino, G. (PI) ; Kovacs, G. (PI) ; Kozyrakis, C. (PI) ; Lall, S. (PI) ; Lam, M. (PI) ; Lee, T. (PI) ; Leeson, D. (PI) ; Levin, C. (PI) ; Levis, P. (PI) ; Levoy, M. (PI) ; Linscott, I. (PI) ; Luckham, D. (PI) ; Macovski, A. (PI) ; Manoharan, H. (PI) ; McCluskey, E. (PI) ; McConnell, M. (PI) ; McKeown, N. (PI) ; Meng, T. (PI) ; Miller, D. (PI) ; Mitchell, J. (PI) ; Mitra, S. (PI) ; Montanari, A. (PI) ; Murmann, B. (PI) ; Napel, S. (PI) ; Ng, A. (PI) ; Nishi, Y. (PI) ; Nishimura, D. (PI) ; Olukotun, O. (PI) ; Osgood, B. (PI) ; Ozgur, A. (PI) ; Paulraj, A. (PI) ; Pauly, J. (PI) ; Pauly, K. (PI) ; Pease, R. (PI) ; Pelc, N. (PI) ; Pianetta, P. (PI) ; Plummer, J. (PI) ; Poon, A. (PI) ; Pop, E. (PI) ; Powell, J. (PI) ; Prabhakar, B. (PI) ; Pratt, V. (PI) ; Quate, C. (PI) ; Rajagopal, R. (PI) ; Rivas-Davila, J. (PI) ; Rosenblum, M. (PI) ; Saraswat, K. (PI) ; Shahidi, R. (PI) ; Shen, Z. (PI) ; Shenoy, K. (PI) ; Siegel, M. (PI) ; Smith, J. (PI) ; Solgaard, O. (PI) ; Spielman, D. (PI) ; Stinson, J. (PI) ; Thrun, S. (PI) ; Tobagi, F. (PI) ; Tyler, G. (PI) ; Ullman, J. (PI) ; Van Roy, B. (PI) ; Vuckovic, J. (PI) ; Wandell, B. (PI) ; Wang, S. (PI) ; Weissman, T. (PI) ; White, R. (PI) ; Widom, J. (PI) ; Widrow, B. (PI) ; Wong, H. (PI) ; Wong, S. (PI) ; Wooley, B. (PI) ; Xing, L. (PI) ; Yamamoto, Y. (PI) ; Zebker, H. (PI)

EE 92A: Making and Breaking Things

This course will feature weekly visiting speakers who will guide class members through the hands-on process of assembling or dissection novel interactive devices and products. The course is meant to provide students hands-on experience with component sensing and computing technolo-gies, a working knowledge of different materials and methods used in modern-day prototyping and manufacture, and exposure to people en-gaged in designing novel devices within the field of interactive device de-sign. Activities will features a wide and evolving range of domains such as texile sensors, hacking wireless radio, making LED light sculptures, taking apart toys, shape deposition modeling and more.

EE 107: Networked Systems

Networks form the interconnect that stitch together our digital and physical lives. They underpin cloud computing, our mobile connectivity, as well as the means to connect the large number of sensors that will pervade our physical surroundings. This class will provide hands on introduction to how networks at these different scales are designed, from datacenters to embedded low power networks. Students will learn these concepts through a project that involves building a wireless network from the ground up using software radios. Students will also learn how to use these networks to build embedded applications (e.g. wireless controlled network of drones, localization systems using WiFi). The goal is to introduce students to larger concepts in electrical engineering and computer systems: the role of abstraction and layering, building reliable systems out of unreliable components and dynamic sharing of scarce resources. Prerequisites: EE 102A or ENGR 40M.
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